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Antenna-in-Package Technology and Applications by Duixian Liu (English) Hardcove

Antenna-in-Package-Technology-and-Applications-by-Duixian-Liu-English-Hardcove-01-lb

Antenna-in-Package Technology and Applications. By Duixian Liu, Yueping Zhang. A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on howRead More


Antenna-in-Package Technology and Applications by Duixian Liu (English) Hardcove

Antenna-in-Package-Technology-and-Applications-by-Duixian-Liu-English-Hardcove-01-vebt

Antenna-in-Package Technology and Applications. By Duixian Liu, Yueping Zhang. A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on howRead More


Antenna-in-Package Technology and Applications (IEEE Press) by Duixian

Antenna-in-Package-Technology-and-Applications-IEEE-Press-by-Duixian-01-kioo

List of Contributors xiii Preface xv Abbreviations xix 1 Introduction 1 Yueping Zhang 1.1 Background 1 1.2 The Idea 3 1.3 Exploring the Idea 4 1.3.1 Bluetooth Radio and Other RF Applications 4 1.3.2 60-GHz Radio and Other Millimeter-wave Applications 7 1.4 Developing the Idea into a Mainstream Technology 8 1.5 Concluding Remarks 11 Acknowledgements 12 References 12 2 Antennas 17 Yueping Zhang 2.1 Introduction 17 2.2 Basic Antennas 17 2.2.1 Dipole 17 2.2.2 Monopole 18 2.2.3 Loop 18 2.2.4 Slot 19 2.3 Unusual Antennas 19 2.3.1 Laminated Resonator AntennaRead More


Antenna-in-Package Technology and Applications (IEEE Press) by Duixian

Antenna-in-Package-Technology-and-Applications-IEEE-Press-by-Duixian-01-ugm

List of Contributors xiii Preface xv Abbreviations xix 1 Introduction 1 Yueping Zhang 1.1 Background 1 1.2 The Idea 3 1.3 Exploring the Idea 4 1.3.1 Bluetooth Radio and Other RF Applications 4 1.3.2 60-GHz Radio and Other Millimeter-wave Applications 7 1.4 Developing the Idea into a Mainstream Technology 8 1.5 Concluding Remarks 11 Acknowledgements 12 References 12 2 Antennas 17 Yueping Zhang 2.1 Introduction 17 2.2 Basic Antennas 17 2.2.1 Dipole 17 2.2.2 Monopole 18 2.2.3 Loop 18 2.2.4 Slot 19 2.3 Unusual Antennas 19 2.3.1 Laminated Resonator AntennaRead More


Antenna-in-package Technology and Applications, Hardcover by Liu, Duixian Zh

Antenna-in-package-Technology-and-Applications-Hardcover-by-Liu-Duixian-Zh-01-vlhr

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging. Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. Th includes information on how the choice of interconnects is governed by JEDEC for automaticRead More


Antenna-in-Package Technology and Applications (IEEE Press) by Duixian

Antenna-in-Package-Technology-and-Applications-IEEE-Press-by-Duixian-01-adc

List of Contributors xiii Preface xv Abbreviations xix 1 Introduction 1 Yueping Zhang 1.1 Background 1 1.2 The Idea 3 1.3 Exploring the Idea 4 1.3.1 Bluetooth Radio and Other RF Applications 4 1.3.2 60-GHz Radio and Other Millimeter-wave Applications 7 1.4 Developing the Idea into a Mainstream Technology 8 1.5 Concluding Remarks 11 Acknowledgements 12 References 12 2 Antennas 17 Yueping Zhang 2.1 Introduction 17 2.2 Basic Antennas 17 2.2.1 Dipole 17 2.2.2 Monopole 18 2.2.3 Loop 18 2.2.4 Slot 19 2.3 Unusual Antennas 19 2.3.1 Laminated Resonator AntennaRead More


Antenna-in-Package Technology and Applications by Duixian Liu (English) Hardcove

Antenna-in-Package-Technology-and-Applications-by-Duixian-Liu-English-Hardcove-01-rbg

Antenna-in-Package Technology and Applications. By Duixian Liu, Yueping Zhang. A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on howRead More


Antenna-in-Package Technology and Applications by Duixian Liu (English) Hardcove

Antenna-in-Package-Technology-and-Applications-by-Duixian-Liu-English-Hardcove-01-may

Antenna-in-Package Technology and Applications. By Duixian Liu, Yueping Zhang. A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on howRead More


Antenna-in-package Technology and Applications, Hardcover by Liu, Duixian Zh

Antenna-in-package-Technology-and-Applications-Hardcover-by-Liu-Duixian-Zh-01-gwzd

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging. Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. Th includes information on how the choice of interconnects is governed by JEDEC for automaticRead More


Antenna-in-Package Technology and Applications by Duixian Liu (English) Hardcove

Antenna-in-Package-Technology-and-Applications-by-Duixian-Liu-English-Hardcove-01-ihhp

Antenna-in-Package Technology and Applications. By Duixian Liu, Yueping Zhang. A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on howRead More